3M Wafer De-Taping Tape 3305, 25 mm x 100 m

3M Wafer De-Taping Tape 3305, 25 mm x 100 m

3M

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• Part Number7010321285
• Brand3M
• CategoryElectronics Films & Tapes

Features

Downloads

Datasheet

Key points

• Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
• Transparency allows for inspection without tape removal
• High instant adhesion to substrate
• Good holding power

3M Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.A transparent polyester film tape with an agressive rubber adhesive specifically designed for the removal of silicon wafer backgrinding tape.