MG Chemicals 8329TFF Fast Cure Thermal Adhesive
MG Chemicals
‘);})(this)”loading=”lazy” />
- 8329TFF-25ML
- MG Chemicals
- Adhesives and Bonding
Downloads
No files available.
25ml bottle
This thermal epoxy glue is a 2-part, 1-1 system with a set time of only 15 minutes. It is a smooth off-white paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. It is UL 94V-0 registered as flame retardant (UL File E334302). It bonds well to metals, ceramics, glass, and most plastics used in electronic assemblies.
Thermal glue is often used to bond heatsinks to CPUs. It may also be used to glue heatsinks to LEDs and other electronic components, and in many other applications that require a fast setting, thermally conductive, electrically insulating adhesive.
This product is viscous, yet flowable enough to be dispensed from a syringe. The 50ml size may be used with a mixing tip when dispensing with a caulking gun or pressurized system.
This thermal glue has a 5-minute working time. We also offer a longer working time alternatives (8349TFM, 8329TFS), a heat-cure 1-part alternative (9460TC), and a non-thermally conductive high-strength version (9200FR). Electrically conductive adhesives, and thermal pastes are also available.
Features & Benefits
Thermal conductivity of 0.8 W/(m·K)
1:1 mix ratio
Flame retardant ? UL 94V-0 registered
Working time: 5 minutes
Set time: 15 minutes
Provides strong electrical insulation
Low CTE prior Tg
High tensile and compressive strength
Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons
